Circuit board having a heating means and a hermetically sealed multi-chip package
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United States of America Patent
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-
Apr 6, 2010
Grant Date -
Oct 31, 2002
app pub date -
Apr 12, 2002
filing date -
Apr 30, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A circuit board having heating elements and a hermetically sealed multi-chip package. The multi-chip package includes a plurality of semiconductor chips, a substrate electrically coupled to the plurality of semiconductor chips, heat dissipation means, and a plurality of thermal interfaces disposed between the semiconductor chips and the heat dissipation means. The heat dissipation means forms a hermetically sealed cavity that encloses the semiconductor chips and at least a portion of the substrate. The circuit board includes a chip mounting surface, a chip mounting area on the chip mounting surface, the chip mounting area including a plurality of lands, and heating elements connected to the lands, the heating elements capable heating a joint formed between the lands and electrode pads of a semiconductor chip.
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