Sawing tile corners on probe card substrates
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United States of America Patent
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Apr 6, 2010
Grant Date -
Dec 20, 2007
app pub date -
Jun 16, 2006
filing date -
Jun 16, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A composite substrate for testing semiconductor devices is formed by selecting a plurality of substantially identical individual substrates, cutting a corner from at least some of the individual substrates in accordance with their position in a final array configuration, and then assembling the individual substrates into the final array configuration. The final array configuration of substrates with corners cut or sawed away conforms more closely to the surface area of a wafer being tested, and can easily fit within space limits of a test environment.
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