Cluster tool substrate throughput optimization
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 20, 2010
Grant Date -
Jun 22, 2006
app pub date -
Jan 30, 2006
filing date -
Dec 22, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history. In one embodiment, non-orthogonal robot trajectories are used to assure reliable and high speed substrate transfer. In another embodiment, at least one buffering station is used to avoid collision and improve throughput. In another embodiment, optimal positioning of the robots are used to improve throughput.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully