High density planar electrical interface
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United States of America Patent
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Apr 20, 2010
Grant Date -
Jun 26, 2008
app pub date -
Feb 20, 2008
filing date -
Jun 20, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor and terminates about a surface of the substrate such that the conductors of respective ones of plurality of cables are planarly aligned and available for electrical contact. A system including a cable interface extending through respective ones of a plurality of through holes of a body of the interface; an interconnection component comprising a first plurality of contact points aligned with respective ones of conductors of the plurality of cables and a second plurality of contact points aligned to corresponding contact points of a device to be tested. Also, a method of routing signals through the conductors of the plurality of cables between electronic components.
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