Photosensitive resin composition, image forming material and image forming method using thereof

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United States of America Patent

PATENT NO 7700264
SERIAL NO

11589891

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Abstract

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A photosensitive resin composition containing an alkali soluble resin, an ethylenically unsaturated compound, a near infrared absorbing dye, a compound containing a halomethyl group and a compound containing an organoboron anion, wherein the alkali soluble resin is an acryl resin having one or more pendant groups in which both terminals of a diol compound have been blocked with isophorone diisocyanates and then (meth)acryloyl has been added. Also provided is an image forming material having a substrate, and a photosensitive layer formed by the photosensitive resin composition on the substrate, as well as an image forming method.

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Patent Owner(s)

Patent OwnerAddress
NIPPON PAINT CO LTDAICHI PREFECTURE JAPAN AICHI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Umemoto, Hirotoshi Osaka, JP 24 180

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