Integrated circuit package system for chip on lead
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United States of America Patent
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Apr 20, 2010
Grant Date -
Mar 27, 2008
app pub date -
Sep 18, 2007
filing date -
Sep 18, 2006
priority date (Note) -
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Abstract
An integrated circuit package system includes providing an integrated circuit die having planar dimensions; forming a lead extended across one of the planar dimensions of the integrated circuit die; and applying an adhesive layer over the lead of a side opposite the integrated circuit die.
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