Low profile discrete electronic components and applications of same
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United States of America Patent
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Apr 20, 2010
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N/A
app pub date -
Jun 1, 2004
filing date -
May 30, 2003
priority date (Note) -
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Abstract
Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package.
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