Device having patterned spacers for backplates and method of making the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 20, 2010
Issued Date -
N/A
app pub date -
Mar 7, 2005
filing date -
Sep 27, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Described herein are systems, devices, and methods relating to packaging electronic devices, for example, microelectromechanical systems (MEMS) devices, including optical modulators such as interferometric optical modulators. The packaging system disclosed herein comprises a patterned spacer that, in some embodiments, is fabricated using thin-film methods. In some embodiments, the spacer together with a substrate and backplate package an electronic device.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully