Multilayered circuit board design support method, program, and apparatus for suppressing thermal diffusion from solid-layer conductor to through hole

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United States of America Patent

PATENT NO 7703064
APP PUB NO 20070079276A1
SERIAL NO

11311655

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A multilayered board data input unit inputs design data of a multilayered circuit board provided with through holes penetrating and mutually connecting solid-layer conductors disposed in a multilayer manner. A limitation rule setting unit sets a limitation rule for limiting the number of solid-layer conductors to be connected to the through holes. A separation processing unit separates connections of the solid-layer conductors to the through holes in the design data based on the limitation rule. At this time, when a solid-layer conductor to be separated from the through holes is selected as a candidate, the separation processing unit determines whether the solid-layer conductor is isolated by separation, when the solid-layer conductor is not isolated, determines isolation, and when the solid-layer conductor is isolated, stops separation.

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Patent Owner(s)

Patent OwnerAddress
FUJITSU LIMITEDKAWASAKI-SHI KANAGAWA 211-8588

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ashida, Takayuki Kawasaki, JP 15 79
Tsubone, Kenichirou Kawasaki, JP 1 9

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