
US Patent No: 7,704,772
Number of patents in Portfolio can not be more than 2000
Method of manufacture for microelectromechanical devices
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Apr 27, 2010
Issued date -
Nov 14, 2008
filing date -
12/271,793
serial no -
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Abstract
A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.
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First Claim
Related Publications
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 6,040,937 Interferometric modulation | 573 | 1996 | |
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Patent Citation Ranking
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