Device having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuitry of an integrated circuit
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United States of America Patent
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Apr 27, 2010
Grant Date -
May 10, 2007
app pub date -
Sep 19, 2006
filing date -
Oct 21, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
One embodiment of the present invention provides advice for providing a low noise power supply package to an integrated circuit comprising a semiconductor die, input/output power supply terminals, and an array of embedded ceramic capacitors selected from discrete, planar and combinations thereof wherein said capacitors are placed in the locations selected from within the perimeter of the shadow of the semiconductor die, partially within the perimeter of the shadow of the semiconductor die, near the perimeter of the shadow of the semiconductor die, and combinations thereof.
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