Component-embedded circuit board fabrication method
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United States of America Patent
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May 4, 2010
Grant Date -
May 15, 2008
app pub date -
Dec 21, 2007
filing date -
Jul 9, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A method of fabricating a component-embedded board including detecting, before the board is covered with an insulating layer, the actual position of an electronic component formed on the surface of the board, calculating a displacement between the design position of the electronic component and the actual position of the electronic component on the surface of the board, and for holding the displacement as displacement data, and correcting, based on the displacement data, design data to be used for processing the board after the board is covered with the insulating layer.
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