Method and apparatus for processing thin metal layers

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United States of America Patent

PATENT NO 7709378
SERIAL NO

11502056

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method and apparatus for processing a thin metal layer on a substrate to control the grain size, grain shape, and grain boundary location and orientation in the metal layer by irradiating the metal layer with a first excimer laser pulse having an intensity pattern defined by a mask to have shadow regions and beamlets. Each region of the metal layer overlapped by a beamlet is melted throughout its entire thickness, and each region of the metal layer overlapped by a shadow region remains at least partially unmelted. After completion of resolidification of the melted regions following irradiation by the first excimer laser pulse, the metal layer is irradiated by a second excimer laser pulse having a shifted intensity pattern so that the shadow regions overlap regions of the metal layer having fewer and larger grains.

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Patent Owner(s)

  • THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Im, James S New York, US 82 2444

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