Adhesive-less DC bus system and method for manufacturing
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United States of America Patent
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May 4, 2010
Grant Date -
Jan 31, 2008
app pub date -
Jul 27, 2006
filing date -
Jul 27, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A system and method for manufacturing a power bus assembly is provided. The power bus assembly includes a first conductive sheet configured to receive a positive charge and distribute the positive charge to a plurality of connection points formed thereon. The power bus assembly also includes a second conductive sheet configured to receive a negative charge and distribute the negative charge to a plurality of connection points formed thereon. Additionally, the power bus assembly includes an insulating sheet arranged between the first conductive sheet and the second conductive sheet to electrically isolate the first conductive sheet from the second conductive sheet. A plurality of vice fasteners are included to secure the first conductive sheet, the second conductive sheet, and the insulating sheet together to form the power bus assembly.
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