Stacked ball grid array package module utilizing one or more interposer layers
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United States of America Patent
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May 4, 2010
Grant Date -
Aug 17, 2006
app pub date -
Feb 8, 2006
filing date -
Feb 14, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A multilayer module comprised of stacked IC package layers is disclosed. A plurality of layers preferably having ball grid array I/O are stacked and interconnected using one or more interposer layers for the routing of electronic signals to appropriate locations in the module through angularly depending leads. The stack is further comprised of an interface PCB for the routing of electronics signals to and from the layers in the module and for connection to an external circuit.
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