Importance

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Abstract

Disclosed is a method of testing electrical characteristics of a semiconductor device having a ball-shaped external electrode. The method comprises preparing a plurality of cantilever-type contactors each supported by a support plate at a given position, and formed in such a manner that a tip thereof has a flat surface with an arc-shaped edge in an outer peripheral region thereof, and a cross-sectional diameter in a vicinity of the tip is greater than a radius of the ball-shaped external electrode, and pairing the cantilever-type contactors to provide paired two contactors. The method includes the steps of: pressing either one of the support plate and the semiconductor device toward the other in such a manner that the arc-shaped edges of the paired two contactors are brought into contact with respective ones of two surface regions of the ball-shaped external electrode divided by an axis of the ball-shaped external electrode passing through a middle point between the two positions where the paired two contactors are supported, so as to form Kelvin contacts; and further overly driving either one of the support plate and the semiconductor device relative to the other in such a manner that the arc-shaped edges of the paired two contactors are slidingly moved along respective ones of the two surface regions of the ball-shaped external electrode to perform a wiping operation.

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First Claim