Probe card assembly
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United States of America Patent
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May 4, 2010
Grant Date -
Dec 24, 2009
app pub date -
Aug 28, 2008
filing date -
Jun 19, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed is a probe card assembly including a main body, a probe base provided at a center of the main body, and a plurality of test probes connecting the main body and the probe base. Therein, each of the test probes has a tip extending out from the probe base for contacting and testing a wafer. The test probes include at least one power probe, at least one grounding probe and a plurality of signal probes, wherein each of the test probes has a middle section between the main body and the probe base. Each of the power probe and the signal probes further contains therein a core that is wrapped by an insulation layer.
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