Micromechanical flow sensor with tensile coating
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United States of America Patent
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May 11, 2010
Grant Date -
Oct 4, 2007
app pub date -
Oct 3, 2006
filing date -
Jan 10, 2001
priority date (Note) -
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Abstract
A sensor integrated on a semiconductor device (1), in particular a flow sensor, comprises a measuring element (2) on a membrane (5). In order to prevent a buckling of the membrane (5) a tensile coating (9) is applied. The coating covers the membrane, but it preferably leaves all the active electronic components integrated on the semiconductor chip (1) uncovered, such that their electrical properties are not affected.
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