Methods for thinning semiconductor substrates that employ support structures formed on the substrates

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7713841
APP PUB NO 20050064681A1
SERIAL NO

10666742

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A support structure for use with a semiconductor substrate in thinning, or backgrinding, thereof, as well as during post-thinning processing of the semiconductor substrate includes a portion which extends substantially along and around an outer periphery of the semiconductor substrate to impart the thinned semiconductor substrate with rigidity. The support structure may be configured as a ring or as a member which substantially covers an active surface of the semiconductor substrate and forms a protective structure over each semiconductor device carried by the active surface. Assemblies that include the support structure and a semiconductor substrate are also within the scope of the present invention, as are methods for forming the support structures and thinning and post-thinning processes that include use of the support structures.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID19162

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akram, Salman Boise, US 792 26821
Benson, Peter Boise, US 31 353
Farnworth, Warren M Nampa, US 852 29400
Hembree, David R Boise, US 377 12935
Hiatt, William M Eagle, US 121 3266
Kirby, Kyle K Boise, US 161 3819
Rigg, Sidney B Meridian, US 35 980
Wood, Alan G Boise, US 414 20140

Cited Art Landscape

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* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
SKYWORKS SOLUTIONS, INC. (5)
8900931 In-situ cavity integrated circuit package 0 2007
8324728 Wafer level packaging using flip chip mounting 10 2008
* 2010/0244,161 WAFER LEVEL PACKAGING USING FLIP CHIP MOUNTING 7 2008
8809116 Method for wafer level packaging of electronic devices 1 2012
9153551 Integrated circuit package including in-situ formed cavity 0 2014
* Cited By Examiner

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