US Patent No: 7,713,841
Number of patents in Portfolio can not be more than 2000
Methods for thinning semiconductor substrates that employ support structures formed on the substrates
Stats
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May 11, 2010
Issued date -
Sep 19, 2003
filing date -
10/666,742
serial no -
In Force
status
Importance
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Abstract
A support structure for use with a semiconductor substrate in thinning, or backgrinding, thereof, as well as during post-thinning processing of the semiconductor substrate includes a portion which extends substantially along and around an outer periphery of the semiconductor substrate to impart the thinned semiconductor substrate with rigidity. The support structure may be configured as a ring or as a member which substantially covers an active surface of the semiconductor substrate and forms a protective structure over each semiconductor device carried by the active surface. Assemblies that include the support structure and a semiconductor substrate are also within the scope of the present invention, as are methods for forming the support structures and thinning and post-thinning processes that include use of the support structures.
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First Claim
Related Publications
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
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| 5,803,797 Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck | 33 | 1996 | |
| 5,953,590 Method and apparatus to hold integrated circuit chips onto a chuck and to simultaneously remove multiple integrated circuit chips from a cutting chuck | 24 | 1997 | |
| 6,140,151 Semiconductor wafer processing method | 55 | 1998 | |
| 6,303,469 Thin microelectronic substrates and methods of manufacture | 32 | 2000 | |
| 6,326,698 Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices | 214 | 2000 | |
| 6,537,482 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography | 31 | 2000 | |
| 6,432,752 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages | 40 | 2000 | |
| 6,524,881 Method and apparatus for marking a bare semiconductor die | 28 | 2000 | |
| 6,245,646 Film frame substrate fixture | 19 | 2000 | |
| 6,399,464 Packaging die preparation | 19 | 2000 | |
| 6,562,661 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same | 16 | 2001 | |
| 6,593,171 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages | 40 | 2002 | |
| 6,908,784 Method for fabricating encapsulated semiconductor components | 143 | 2002 | |
| 6,734,032 Method and apparatus for marking a bare semiconductor die | 16 | 2002 | |
| 6,683,378 System for singulating semiconductor components utilizing alignment pins | 7 | 2003 | |
| 2005/0064,681 Support structure for thinning semiconductor substrates and thinning methods employing the support structure | 21 | 2003 | |
| 6,940,181 Thinned, strengthened semiconductor substrates and packages including same | 15 | 2003 | |
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| 5,869,354 Method of making dielectrically isolated integrated circuit | 62 | 1994 | |
| 5,824,457 Use of WEE (wafer edge exposure) to prevent polyimide contamination | 14 | 1996 | |
| 5,723,385 Wafer edge seal ring structure | 21 | 1996 | |
| 6,033,589 Method for depositing a coating layer on a wafer without edge bead formation | 9 | 1997 | |
| 6,040,248 Chemistry for etching organic low-k materials | 45 | 1998 | |
| 6,042,976 Method of calibrating WEE exposure tool | 19 | 1999 | |
| 6,114,253 Via patterning for poly(arylene ether) used as an inter-metal dielectric | 11 | 1999 | |
| 6,736,896 Gas spray arm for spin coating apparatus | 5 | 2002 | |
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| 5,268,065 Method for thinning a semiconductor wafer | 67 | 1992 | |
| 5,703,493 Wafer holder for semiconductor applications | 21 | 1995 | |
| 6,150,240 Method and apparatus for singulating semiconductor devices | 21 | 1998 | |
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| 6,259,962 Apparatus and method for three dimensional model printing | 163 | 1999 | |
| 2002/0171,177 System and method for printing and supporting three dimensional objects | 88 | 2002 | |
| 2003/0151,167 Device, system and method for accurate printing of three dimensional objects | 92 | 2003 | |
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| 6,268,584 Multiple beams and nozzles to increase deposition rate | 111 | 1998 | |
| 6,251,488 Precision spray processes for direct write electronic components | 145 | 1999 | |
| 6,391,251 Forming structures from CAD solid models | 157 | 2000 | |
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| 6,413,150 Dual dicing saw blade assembly and process for separating devices arrayed a substrate | 14 | 2000 | |
| 6,471,806 Method of adhering a wafer to wafer tape | 14 | 2000 | |
| 6,686,225 Method of separating semiconductor dies from a wafer | 24 | 2001 | |
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| 5,675,402 Stepper light control using movable blades | 17 | 1995 | |
| 6,339,255 Stacked semiconductor chips in a single semiconductor package | 149 | 1999 | |
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| 5,919,520 Coating method and apparatus for semiconductor process | 56 | 1997 | |
| 6,749,688 Coating method and apparatus for semiconductor process | 21 | 1999 | |
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| 5,827,394 Step and repeat exposure method for loosening integrated circuit dice from a radiation sensitive adhesive tape backing | 34 | 1997 | |
| 6,486,939 Electronically controlled universal phase-shifting mask for stepper exposure system | 15 | 2001 | |
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| 2004/0229,002 Stereolithographic seal and support structure for semiconductor wafer | 11 | 2003 | |
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| 6,489,042 Photoimageable dielectric material for circuit protection | 6 | 2001 | |
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| 6,465,329 Microcircuit die-sawing protector and method | 26 | 1999 | |
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| 5,460,703 Low thermal expansion clamping mechanism | 28 | 1994 | |
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| 5,610,683 Immersion type projection exposure apparatus | 521 | 1995 | |
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| 6,323,295 Polymerizable composition, process for producing cross-linked polymers and crosslinkable polymers | 13 | 1997 | |
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| 5,833,869 Method for etching photolithographically produced quartz crystal blanks for singulation | 13 | 1997 | |
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| 6,344,402 Method of dicing workpiece | 41 | 2000 | |
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| 7,118,938 Method for packaging a multi-chip module of a semiconductor device | 5 | 2003 | |
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| 6,680,241 Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices | 13 | 2000 | |
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| 6,143,590 Multi-chip semiconductor device and method of producing the same | 19 | 1999 | |
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| 6,589,818 Method for mounting a thin semiconductor device | 2 | 2002 | |
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| 6,472,294 Semiconductor processing method for processing discrete pieces of substrate to form electronic devices | 15 | 2001 | |
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| 7,140,951 Semiconductor device manufacturing apparatus and semiconductor device manufacturing method for forming semiconductor chips by dividing semiconductor wafer | 5 | 2003 | |
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| 6,582,983 Method and wafer for maintaining ultra clean bonding pads on a wafer | 21 | 2002 | |
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| 6,111,306 Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same | 31 | 1997 | |
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| 5,705,016 Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet | 38 | 1995 | |
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| 6,506,688 Method for removing photoresist layer on wafer edge | 10 | 2001 | |
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| 6,048,948 Method for producing a polymer composite material | 11 | 1997 | |
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| 6,621,161 Semiconductor device having a package structure | 15 | 2001 | |
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| 5,114,880 Method for fabricating multiple electronic devices within a single carrier structure | 41 | 1991 | |
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| 6,468,832 Method to encapsulate bumped integrated circuit to create chip scale package | 21 | 2000 | |
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| 6,462,401 Semiconductor wafer having a bank on a scribe line | 10 | 2001 | |
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| 2002/0091,173 Re-release adhesive and re-release adhesive sheet | 8 | 2001 | |
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| 6,551,906 Method of fabricating semiconductor device | 28 | 2000 | |
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| 6,322,598 Semiconductor processing system for processing discrete pieces of substrate to form electronic devices | 18 | 1999 | |
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| 4,266,334 Manufacture of thinned substrate imagers | 46 | 1979 | |
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| 6,039,830 Method of and apparatus for laminating a semiconductor wafer with protective tape | 18 | 1998 | |
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| 6,974,721 Method for manufacturing thin semiconductor chip | 5 | 2003 | |
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| 6,462,273 Semiconductor card and method of fabrication | 66 | 2001 | |
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| 5,843,527 Coating solution applying method and apparatus | 37 | 1996 | |
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| 4,925,515 Method and apparatus for applying a protective tape on a wafer and cutting it out to shape | 42 | 1988 | |
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| 5,547,906 Methods for producing integrated circuit devices | 88 | 1994 | |
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| 5,121,256 Lithography system employing a solid immersion lens | 311 | 1991 | |
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| 6,498,074 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners | 43 | 2001 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
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| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Nov 11, 2013 |
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| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Nov 11, 2021 |
| Fee | Large entity fee | small entity fee | micro entity fee |
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