US Patent No: 7,713,841

Number of patents in Portfolio can not be more than 2000

Methods for thinning semiconductor substrates that employ support structures formed on the substrates

Stats

ALSO PUBLISHED AS: 20050064681
See full text
ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A support structure for use with a semiconductor substrate in thinning, or backgrinding, thereof, as well as during post-thinning processing of the semiconductor substrate includes a portion which extends substantially along and around an outer periphery of the semiconductor substrate to impart the thinned semiconductor substrate with rigidity. The support structure may be configured as a ring or as a member which substantially covers an active surface of the semiconductor substrate and forms a protective structure over each semiconductor device carried by the active surface. Assemblies that include the support structure and a semiconductor substrate are also within the scope of the present invention, as are methods for forming the support structures and thinning and post-thinning processes that include use of the support structures.

Loading the Abstract Image... loading....

First Claim

See full text

all claims..

Related Publications

Loading Related Publications... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID20977

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akram, Salman Boise, ID 927 22513
Benson, Peter Boulder, UT 45 244
Farnworth, Warren M Nampa, ID 1015 24860
Hembree, David R Boise, ID 448 10173
Hiatt, William M Eagle, ID 186 1837
Kirby, Kyle K Boise, ID 235 1850
Rigg, Sidney B Meridian, ID 59 478
Wood, Alan G Boise, ID 509 16890

Cited Art Landscape

Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (17)
5,803,797 Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck 33 1996
5,953,590 Method and apparatus to hold integrated circuit chips onto a chuck and to simultaneously remove multiple integrated circuit chips from a cutting chuck 25 1997
6,140,151 Semiconductor wafer processing method 58 1998
6,303,469 Thin microelectronic substrates and methods of manufacture 35 2000
6,326,698 Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices 223 2000
6,537,482 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography 33 2000
6,432,752 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages 40 2000
6,524,881 Method and apparatus for marking a bare semiconductor die 28 2000
6,245,646 Film frame substrate fixture 19 2000
6,399,464 Packaging die preparation 19 2000
6,562,661 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same 16 2001
6,593,171 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages 41 2002
6,908,784 Method for fabricating encapsulated semiconductor components 160 2002
6,734,032 Method and apparatus for marking a bare semiconductor die 18 2002
6,683,378 System for singulating semiconductor components utilizing alignment pins 7 2003
2005/0064,681 Support structure for thinning semiconductor substrates and thinning methods employing the support structure 24 2003
6,940,181 Thinned, strengthened semiconductor substrates and packages including same 16 2003
 
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (8)
5,869,354 Method of making dielectrically isolated integrated circuit 65 1994
5,824,457 Use of WEE (wafer edge exposure) to prevent polyimide contamination 14 1996
5,723,385 Wafer edge seal ring structure 21 1996
6,033,589 Method for depositing a coating layer on a wafer without edge bead formation 9 1997
6,040,248 Chemistry for etching organic low-k materials 45 1998
6,042,976 Method of calibrating WEE exposure tool 19 1999
6,114,253 Via patterning for poly(arylene ether) used as an inter-metal dielectric 11 1999
6,736,896 Gas spray arm for spin coating apparatus 5 2002
 
FREESCALE SEMICONDUCTOR, INC. (3)
5,268,065 Method for thinning a semiconductor wafer 67 1992
5,703,493 Wafer holder for semiconductor applications 22 1995
6,150,240 Method and apparatus for singulating semiconductor devices 21 1998
 
OBJET GEOMETRIES LTD. (3)
6,259,962 Apparatus and method for three dimensional model printing 169 1999
2002/0171,177 System and method for printing and supporting three dimensional objects 90 2002
2003/0151,167 Device, system and method for accurate printing of three dimensional objects 94 2003
 
OPTOMEC DESIGN COMPANY (3)
6,268,584 Multiple beams and nozzles to increase deposition rate 112 1998
6,251,488 Precision spray processes for direct write electronic components 149 1999
6,391,251 Forming structures from CAD solid models 181 2000
 
TEXAS INSTRUMENTS INCORPORATED (3)
6,413,150 Dual dicing saw blade assembly and process for separating devices arrayed a substrate 14 2000
6,471,806 Method of adhering a wafer to wafer tape 14 2000
6,686,225 Method of separating semiconductor dies from a wafer 26 2001
 
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (2)
5,675,402 Stepper light control using movable blades 17 1995
6,339,255 Stacked semiconductor chips in a single semiconductor package 162 1999
 
TOKYO ELECTRON LIMITED (2)
5,919,520 Coating method and apparatus for semiconductor process 58 1997
6,749,688 Coating method and apparatus for semiconductor process 22 1999
 
VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION (2)
5,827,394 Step and repeat exposure method for loosening integrated circuit dice from a radiation sensitive adhesive tape backing 34 1997
6,486,939 Electronically controlled universal phase-shifting mask for stepper exposure system 15 2001
 
3D SYSTEMS, INC. (1)
2004/0229,002 Stereolithographic seal and support structure for semiconductor wafer 12 2003
 
3M INNOVATIVE PROPERTIES COMPANY (1)
6,489,042 Photoimageable dielectric material for circuit protection 6 2001
 
AMKOR TECHNOLOGY, INC. (1)
6,465,329 Microcircuit die-sawing protector and method 26 1999
 
APPLIED MATERIALS, INC. (1)
5,460,703 Low thermal expansion clamping mechanism 28 1994
 
CANON KABUSHIKI KAISHA (1)
5,610,683 Immersion type projection exposure apparatus 601 1995
 
CIBA SPECIALTY CHEMICALS CORPORATION (1)
6,323,295 Polymerizable composition, process for producing cross-linked polymers and crosslinkable polymers 14 1997
 
CTS CORPORATION (1)
5,833,869 Method for etching photolithographically produced quartz crystal blanks for singulation 13 1997
 
DISCO CORPORATION (1)
6,344,402 Method of dicing workpiece 50 2000
 
DONGBU ELECTRONICS CO., LTD. (1)
7,118,938 Method for packaging a multi-chip module of a semiconductor device 5 2003
 
FUJITSU LIMITED (1)
6,680,241 Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices 16 2000
 
FUJITSU SEMICONDUCTOR LIMITED (1)
6,143,590 Multi-chip semiconductor device and method of producing the same 19 1999
 
HITACHI, LTD. (1)
6,589,818 Method for mounting a thin semiconductor device 2 2002
 
IMEC (1)
6,472,294 Semiconductor processing method for processing discrete pieces of substrate to form electronic devices 15 2001
 
INVENSAS CORPORATION (1)
6,498,074 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners 47 2001
 
KABUSHIKI KAISHA TOSHIBA (1)
7,140,951 Semiconductor device manufacturing apparatus and semiconductor device manufacturing method for forming semiconductor chips by dividing semiconductor wafer 5 2003
 
Keteca Singapore Singapore (1)
6,582,983 Method and wafer for maintaining ultra clean bonding pads on a wafer 30 2002
 
Kyushu Fujitsu Electronics Limited (1)
6,111,306 Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same 33 1997
 
LAPIS SEMICONDUCTOR CO., LTD. (1)
6,551,906 Method of fabricating semiconductor device 29 2000
 
LINTEC CORPORATION (1)
5,705,016 Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet 40 1995
 
MACRONIX INTERNATIONAL CO., LTD. (1)
6,506,688 Method for removing photoresist layer on wafer edge 10 2001
 
MAZDA MOTOR CORPORATION (1)
6,048,948 Method for producing a polymer composite material 11 1997
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
6,621,161 Semiconductor device having a package structure 16 2001
 
MOTOROLA, INC. (1)
5,114,880 Method for fabricating multiple electronic devices within a single carrier structure 41 1991
 
NATIONAL SEMICONDUCTOR CORPORATION (1)
6,468,832 Method to encapsulate bumped integrated circuit to create chip scale package 23 2000
 
NEC ELECTRONICS CORPORATION (1)
6,462,401 Semiconductor wafer having a bank on a scribe line 11 2001
 
NITTO DENKO CORPORATION (1)
2002/0091,173 Re-release adhesive and re-release adhesive sheet 9 2001
 
QUALCOMM INCORPORATED (1)
6,322,598 Semiconductor processing system for processing discrete pieces of substrate to form electronic devices 19 1999
 
RCA Corporation (1)
4,266,334 Manufacture of thinned substrate imagers 48 1979
 
SAMSUNG ELECTRONICS CO., LTD. (1)
6,039,830 Method of and apparatus for laminating a semiconductor wafer with protective tape 18 1998
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (1)
6,974,721 Method for manufacturing thin semiconductor chip 6 2003
 
SIEMENS COMMUNICATIONS, INC. (1)
6,462,273 Semiconductor card and method of fabrication 76 2001
 
SOKUDO CO., LTD. (1)
5,843,527 Coating solution applying method and apparatus 39 1996
 
Takatori Hitech Co., Ltd. (1)
4,925,515 Method and apparatus for applying a protective tape on a wafer and cutting it out to shape 44 1988
 
TESSERA TECHNOLOGIES HUNGARY KFT. (1)
5,547,906 Methods for producing integrated circuit devices 94 1994
 
THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY (1)
5,121,256 Lithography system employing a solid immersion lens 346 1991

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
SKYWORKS SOLUTIONS, INC. (1)
8,324,728 Wafer level packaging using flip chip mounting 1 2008

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Nov 11, 2013
7.5 Year Payment $3600.00 $1800.00 $900.00 Nov 11, 2017
11.5 Year Payment $7400.00 $3700.00 $1850.00 Nov 11, 2021
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00