US Patent No: 7,713,841

Number of patents in Portfolio can not be more than 2000

Methods for thinning semiconductor substrates that employ support structures formed on the substrates

ALSO PUBLISHED AS: 20050064681

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Abstract

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A support structure for use with a semiconductor substrate in thinning, or backgrinding, thereof, as well as during post-thinning processing of the semiconductor substrate includes a portion which extends substantially along and around an outer periphery of the semiconductor substrate to impart the thinned semiconductor substrate with rigidity. The support structure may be configured as a ring or as a member which substantially covers an active surface of the semiconductor substrate and forms a protective structure over each semiconductor device carried by the active surface. Assemblies that include the support structure and a semiconductor substrate are also within the scope of the present invention, as are methods for forming the support structures and thinning and post-thinning processes that include use of the support structures.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID18629

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akram, Salman Boise, ID 936 23990
Benson, Peter Boulder, UT 45 280
Farnworth, Warren M Nampa, ID 1023 26427
Hembree, David R Boise, ID 455 11181
Hiatt, William M Eagle, ID 193 2275
Kirby, Kyle K Boise, ID 250 2355
Rigg, Sidney B Meridian, ID 59 580
Wood, Alan G Boise, ID 517 18144

Cited Art Landscape

Patent Info (Count) # Cites Year
 
NITTO DENKO CORPORATION (1)
2002/0091,173 Re-release adhesive and re-release adhesive sheet 9 2001
 
DISCO CORPORATION (1)
6,344,402 Method of dicing workpiece 62 2000
 
MICRON TECHNOLOGY, INC. (17)
5,803,797 Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck 36 1996
5,953,590 Method and apparatus to hold integrated circuit chips onto a chuck and to simultaneously remove multiple integrated circuit chips from a cutting chuck 26 1997
6,140,151 Semiconductor wafer processing method 59 1998
6,303,469 Thin microelectronic substrates and methods of manufacture 36 2000
6,326,698 Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices 235 2000
6,537,482 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography 33 2000
6,432,752 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages 40 2000
* 6,524,881 Method and apparatus for marking a bare semiconductor die 29 2000
6,245,646 Film frame substrate fixture 20 2000
6,399,464 Packaging die preparation 19 2000
* 6,562,661 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same 16 2001
6,593,171 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages 41 2002
6,908,784 Method for fabricating encapsulated semiconductor components 187 2002
6,734,032 Method and apparatus for marking a bare semiconductor die 19 2002
6,683,378 System for singulating semiconductor components utilizing alignment pins 7 2003
2005/0064,681 Support structure for thinning semiconductor substrates and thinning methods employing the support structure 27 2003
6,940,181 Thinned, strengthened semiconductor substrates and packages including same 20 2003
 
FREESCALE SEMICONDUCTOR, INC. (3)
5,268,065 Method for thinning a semiconductor wafer 67 1992
5,703,493 Wafer holder for semiconductor applications 22 1995
6,150,240 Method and apparatus for singulating semiconductor devices 21 1998
 
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (8)
* 5,869,354 Method of making dielectrically isolated integrated circuit 73 1994
5,824,457 Use of WEE (wafer edge exposure) to prevent polyimide contamination 15 1996
5,723,385 Wafer edge seal ring structure 21 1996
6,033,589 Method for depositing a coating layer on a wafer without edge bead formation 9 1997
6,040,248 Chemistry for etching organic low-k materials 45 1998
6,042,976 Method of calibrating WEE exposure tool 19 1999
6,114,253 Via patterning for poly(arylene ether) used as an inter-metal dielectric 13 1999
6,736,896 Gas spray arm for spin coating apparatus 5 2002
 
SAMSUNG ELECTRONICS CO., LTD. (1)
6,039,830 Method of and apparatus for laminating a semiconductor wafer with protective tape 19 1998
 
DSS TECHNOLOGY MANAGEMENT, INC. (1)
7,118,938 Method for packaging a multi-chip module of a semiconductor device 5 2003
 
HITACHI, LTD. (1)
6,589,818 Method for mounting a thin semiconductor device 2 2002
 
LINTEC CORPORATION (1)
5,705,016 Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet 41 1995
 
SIEMENS COMMUNICATIONS, INC. (1)
6,462,273 Semiconductor card and method of fabrication 79 2001
 
Keteca Singapore Singapore (1)
6,582,983 Method and wafer for maintaining ultra clean bonding pads on a wafer 60 2002
 
Ciba Specialty Chemicals Corporation (1)
6,323,295 Polymerizable composition, process for producing cross-linked polymers and crosslinkable polymers 15 1997
 
Mazda Motor Corporation (1)
6,048,948 Method for producing a polymer composite material 11 1997
 
AMKOR TECHNOLOGY, INC. (1)
6,465,329 Microcircuit die-sawing protector and method 27 1999
 
KABUSHIKI KAISHA TOSHIBA (1)
7,140,951 Semiconductor device manufacturing apparatus and semiconductor device manufacturing method for forming semiconductor chips by dividing semiconductor wafer 6 2003
 
FUJITSU SEMICONDUCTOR LIMITED (1)
6,143,590 Multi-chip semiconductor device and method of producing the same 20 1999
 
VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION (2)
5,827,394 Step and repeat exposure method for loosening integrated circuit dice from a radiation sensitive adhesive tape backing 35 1997
6,486,939 Electronically controlled universal phase-shifting mask for stepper exposure system 17 2001
 
TESSERA TECHNOLOGIES HUNGARY KFT. (1)
5,547,906 Methods for producing integrated circuit devices 105 1994
 
INVENSAS CORPORATION (1)
6,498,074 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners 51 2001
 
LAPIS SEMICONDUCTOR CO., LTD. (1)
6,551,906 Method of fabricating semiconductor device 32 2000
 
NEC ELECTRONICS CORPORATION (1)
6,462,401 Semiconductor wafer having a bank on a scribe line 12 2001
 
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (2)
5,675,402 Stepper light control using movable blades 17 1995
6,339,255 Stacked semiconductor chips in a single semiconductor package 180 1999
 
SCREEN SEMICONDUCTOR SOLUTIONS CO., LTD. (1)
5,843,527 Coating solution applying method and apparatus 40 1996
 
Kyushu Fujitsu Electronics Limited (1)
6,111,306 Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same 34 1997
 
CANON KABUSHIKI KAISHA (1)
5,610,683 Immersion type projection exposure apparatus 724 1995
 
QUALCOMM INCORPORATED (1)
6,322,598 Semiconductor processing system for processing discrete pieces of substrate to form electronic devices 19 1999
 
CTS Corporation (1)
5,833,869 Method for etching photolithographically produced quartz crystal blanks for singulation 13 1997
 
3M INNOVATIVE PROPERTIES COMPANY (1)
6,489,042 Photoimageable dielectric material for circuit protection 6 2001
 
IMEC VZW (1)
6,472,294 Semiconductor processing method for processing discrete pieces of substrate to form electronic devices 15 2001
 
THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY (1)
5,121,256 Lithography system employing a solid immersion lens 403 1991
 
3D Systems, Inc. (1)
2004/0229,002 Stereolithographic seal and support structure for semiconductor wafer 14 2003
 
FUJITSU LIMITED (1)
6,680,241 Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices 16 2000
 
Shinko Electric Industries Co., Ltd. (1)
6,974,721 Method for manufacturing thin semiconductor chip 6 2003
 
MOTOROLA, INC. (1)
5,114,880 Method for fabricating multiple electronic devices within a single carrier structure 41 1991
 
OPTOMEC DESIGN COMPANY (3)
6,268,584 Multiple beams and nozzles to increase deposition rate 112 1998
6,251,488 Precision spray processes for direct write electronic components 153 1999
6,391,251 Forming structures from CAD solid models 201 2000
 
Takatori Hitech Co., Ltd. (1)
4,925,515 Method and apparatus for applying a protective tape on a wafer and cutting it out to shape 44 1988
 
MACRONIX INTERNATIONAL CO., LTD. (1)
6,506,688 Method for removing photoresist layer on wafer edge 10 2001
 
NATIONAL SEMICONDUCTOR CORPORATION (1)
6,468,832 Method to encapsulate bumped integrated circuit to create chip scale package 26 2000
 
OBJET GEOMETRIES LTD. (3)
6,259,962 Apparatus and method for three dimensional model printing 185 1999
2002/0171,177 System and method for printing and supporting three dimensional objects 95 2002
2003/0151,167 Device, system and method for accurate printing of three dimensional objects 101 2003
 
APPLIED MATERIALS, INC. (1)
5,460,703 Low thermal expansion clamping mechanism 28 1994
 
Mitsubishi Denki Kabushiki Kaisha (1)
6,621,161 Semiconductor device having a package structure 16 2001
 
TEXAS INSTRUMENTS INCORPORATED (3)
6,413,150 Dual dicing saw blade assembly and process for separating devices arrayed a substrate 16 2000
6,471,806 Method of adhering a wafer to wafer tape 14 2000
6,686,225 Method of separating semiconductor dies from a wafer 32 2001
 
TOKYO ELECTRON LIMITED (2)
5,919,520 Coating method and apparatus for semiconductor process 60 1997
6,749,688 Coating method and apparatus for semiconductor process 25 1999
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
SKYWORKS SOLUTIONS, INC. (3)
8,900,931 In-situ cavity integrated circuit package 0 2007
8,324,728 Wafer level packaging using flip chip mounting 3 2008
8,809,116 Method for wafer level packaging of electronic devices 0 2012
* Cited By Examiner

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