Small structure and method for fabricating the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7714421
APP PUB NO 20060022322A1
SERIAL NO

11192358

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Abstract

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A small structure which uses bonding wires to prevent disturbance and provide support and a method of fabricating the same are provided. The small structure includes a floating body having a plurality of first contact pads, a base having a plurality of second contact pads, and a plurality of bonding wires electrically connecting the first and second contact pads and elastically supporting the floating body. The method of fabricating the small structure includes preparing a base, forming a sacrificial layer on the base, disposing a floating body on the sacrificial layer, connecting the base and the floating body with bonding wires, and removing the sacrificial layer. Thereby, fabrication costs of the small structure are reduced.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDGYEONGGI-DO 16677

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cho, Yong-chul Suwon-si, KR 26 727
Choi, Joon-hyock Seoul, KR 4 21
Kim, Jong-pal Seoul, KR 22 307
Lee, Byeung-leul Yongin-si, KR 13 121
Lee, Sang-woo Seoul, KR 153 2112

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