Ball grid array package format layers and structure
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United States of America Patent
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May 11, 2010
Issued Date -
N/A
app pub date -
Jul 7, 2007
filing date -
Jul 7, 2007
priority date (Note) -
Expired
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Abstract
Layers suitable for stacking in three dimensional, multi-layer modules are formed by interconnecting a ball grid array electronic package to an interposer layer which routes electronic signals to an access plane. The layers are under-filled and may be bonded together to form a stack of layers. The leads on the access plane are interconnected among layers to form a high-density electronic package.
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