Packaging a MEMS device using a frame
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United States of America Patent
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May 11, 2010
Issued Date -
N/A
app pub date -
Apr 13, 2007
filing date -
Apr 13, 2006
priority date (Note) -
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Abstract
A package structure and method of packaging for a MEMS device is described. A transparent substrate having an interferometric modulator array formed thereon is shown. A single or dual-layered backplate is joined to a frame that circumscribes the modulator array. The frame is bonded to the transparent substrate and to the backplate to provide a hermetic package.
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