Method for manufacturing printed wiring board
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United States of America Patent
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May 18, 2010
Grant Date -
Jun 1, 2006
app pub date -
Dec 9, 2002
filing date -
Dec 9, 2002
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A method for manufacturing a printed wiring board, including forming a thermosetting resin layer on the printed wiring board; heating and curing the resin layer; and then polishing the cured resin layer, thereby exposing the circuit patterns. Additionally, the step of heating and curing includes maintaining the resin layer at a non-curable temperature in a state where the resin layer is pressed via the smoothing plate in a reduced pressure chamber; heating the resin layer in the pressed state to a curing temperature; introducing outside air into the reduced pressure chamber with the pressed state and the curing temperature maintained; reducing the pressure applied to the smoothing plate with the curing temperature maintained; and cooling the resin layer.
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