Method of forming wiring pattern and method of manufacturing TFT substrate using the same
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United States of America Patent
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May 18, 2010
Grant Date -
Feb 2, 2006
app pub date -
Aug 1, 2005
filing date -
Aug 2, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of forming a wiring pattern includes forming a first conductive film pattern, an insulating film and a second conductive film pattern intersecting with the first conductive film pattern on an insulating substrate. In the method, an etching resist pattern for forming the second conductive film pattern is formed by use of a screen printing method. Thereafter, an etching resist is softened by exposing the etching resist in an organic solvent atmosphere before hardening thereof. Thus, defects such as spaces in the etching resist are repaired. By use of the above-described method of forming a wiring pattern, a TFT substrate is manufactured.
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