Electrostatic chuck having radial temperature control capability
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United States of America Patent
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May 18, 2010
Grant Date -
Apr 19, 2007
app pub date -
Nov 22, 2006
filing date -
Apr 30, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
An electrostatic chuck (“chuck”) is provided for controlling a radial temperature profile across a substrate when exposed to a plasma. The chuck includes a number of independently controllable gas volumes that are each defined in a radial configuration relative to a top surface of the chuck upon which the substrate is to be supported. The chuck includes a support member and a base plate. The base plate positioned beneath and in a spaced apart relationship from the support member. The gas volumes are defined between the base plate and the support member, with separation provided by annularly-shaped thermally insulating dividers. Each gas volume can include a heat generation source. A gas pressure and heat generation within each gas volume can be controlled to influence thermal conduction through the chuck such that a prescribed radial temperature profile is achieved across the substrate.
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