Physical quantity sensor and semiconductor device having package and cover
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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May 18, 2010
Issued Date -
N/A
app pub date -
Feb 26, 2008
filing date -
Mar 12, 2007
priority date (Note) -
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Abstract
A semiconductor device includes: a semiconductor chip; a package for accommodating the chip, wherein the package has a box shape with an opening and a bottom; and a cover for sealing the opening of the package. The semiconductor chip is disposed on the bottom of the package. The cover has a plate shape. The cover includes a protrusion, which is disposed at a center of the plate shape. The protrusion protrudes toward an outside of the package.
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