Multi-component integrated circuit contacts

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7719120
APP PUB NO 20070018321A1
SERIAL NO

11535414

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An integrated circuit connection is describe that includes a first, securing member and a second, connection member. The first member, in an embodiment, is a spike that has a portion of its body fixed in a layer of an integrated circuit structure and extends outwardly from the integrated circuit structure. The second material is adapted to form a mechanical connection to a further electrical device. The second material (e.g., solder), is held by the first member to the integrated circuit structure. The first member increases the strength of the connection and assists in controlling the collapse of second member to form the mechanical connection to another circuit. The connection is formed by coating the integrated circuit structure with a patterned resist and etching the layer beneath the resist. A first member material (e.g., metal) is deposited. The resist is removed. The collapsible material is fixed to the first member.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Farnworth, Warren M Nampa, US 855 33428
Hiatt, William M Eagle, US 129 4697

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