MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same

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United States of America Patent

PATENT NO 7719752
SERIAL NO

11863079

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Methods of fabricating a microelectromechanical systems (MEMS) device with reduced masking and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. In some embodiments in which the MEMS device serves as an interferometric modulator, the front substrate is also provided with black masks to prevent or mitigate bright areas in the actuated state of the MEMS device. Static interferometric modulators can also be formed by shaping or preformation and lamination. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.

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Patent Owner(s)

Patent OwnerAddress
SNAPTRACK INC5775 MOREHOUSE DR SAN DIEGO CA 92121

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Floyd, Philip Don Redwood City, US 11 520
Gally, Brian James Los Gatos, US 20 554
Sampsell, Jeffrey Brian Pueblo West, US 21 1412

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