Organometallic compounds and methods of forming thin films including the use of the same
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United States of America Patent
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May 25, 2010
Grant Date -
Feb 8, 2007
app pub date -
Jul 27, 2006
filing date -
Aug 2, 2005
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Abstract
The present invention provides organometallic compounds and methods of forming thin films including using the same. The organometallic compounds include a metal and a ligand linked to the metal. The ligand can be represented by the following formula (1):are each independently hydrogen or an alkyl group. The thin films may be applied to semiconductor structures such as a gate insulation layer of a gate structure and a dielectric layer of a capacitor.
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