Package-on-package using through-hole via die on saw streets
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United States of America Patent
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May 25, 2010
Issued Date -
N/A
app pub date -
Jun 26, 2007
filing date -
May 4, 2007
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor package-on-package (PoP) device includes a first die incorporating a through-hole via (THV) disposed along a peripheral surface of the first die. The first die is disposed over a substrate or leadframe structure. A first semiconductor package is electrically connected to the THV of the first die, or electrically connected to the substrate or leadframe structure. An encapsulant is formed over a portion of the first die and the first semiconductor package.
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