Direct-write wafer level chip scale package

United States of America Patent

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May 25, 2010
Grant Date
Oct 18, 2007
app pub date
Jun 6, 2007
filing date
Nov 8, 2002

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Abstract

A method and structure provides a Direct Write Wafer Level Chip Scale Package (DWWLCSP) that utilizes permanent layers/coatings and direct write techniques to pattern these layers/coatings, thereby avoiding the use of photoimagable materials and photo-etching processes.

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Patent Owner	Address
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD	SINGAPORE

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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[Patents Count]

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Inventor Name	Address	# of filed Patents	Total Citations
Berry, Christopher John	Chandler, US	5	85
Hiner, David Jon	Chandler, US	70	1625
Huemoeller, Ronald Patrick	Chandler, US	132	4147

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Direct-write wafer level chip scale package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

11810799

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PATENT NO	7723210
APP PUB NO	20070241446A1
SERIAL NO	11810799
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 25, 2010	US,7723210,B2 US7723210B2	GRANTED PATENT AS SECOND PUBLICATION
October 18, 2007	US,20070241446,A1 US20070241446A1	FIRST PUBLISHED PATENT APPLICATION

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11810799

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