Importance

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Abstract

A method for manufacturing a semiconductor chip having through electrodes includes forming, in a semiconductor wafer, a plurality of electrode forming holes for forming through electrodes, superimposing bump forming masks formed with a plurality of bump holes over the front and back surfaces of the semiconductor wafer respectively so that the electrode forming holes and the bump holes are brought into alignment, placing the semiconductor wafer with the bump forming masks superimposed thereon over a stage, embedding conductive paste into the bump holes and the electrode forming holes from the bump forming mask disposed over the surface on the side opposite to the stage, of the semiconductor wafer, detaching the bump forming masks from the semiconductor wafer after the conductive paste has been embedded, and dividing the semiconductor wafer into fractions after the bump forming masks have been detached.

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First Claim