Microelectronic assembly with back side metallization and method for forming the same
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United States of America Patent
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May 25, 2010
Grant Date -
Dec 20, 2007
app pub date -
Jun 14, 2006
filing date -
Jun 14, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
A method is provided for forming a microelectronic assembly. A contact structure (46) is formed over a first side of a first substrate (20) having a microelectronic device formed over a second side thereof. The contact structure is electrically connected to the microelectronic device. A non-solderable layer (52) is formed over at least a portion of the contact structure and at least a portion of the first substrate. The contact structure and a second substrate (62) are interconnected with solder (68).
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