Step and repeat imprint lithography processes
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United States of America Patent
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Jun 1, 2010
Grant Date -
Apr 13, 2006
app pub date -
May 11, 2005
filing date -
Jul 11, 2002
priority date (Note) -
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Abstract
The present invention is directed to a method of forming a layer on a region of a substrate, the method including, inter alia, positioning a liquid on the substrate; and contacting the liquid with the mold, defining a gap between the mold and the substrate, with the gap enabling positioning of the liquid by capillary forces to generate the layer over the region.
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