Integrated circuit package
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United States of America Patent
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-
Jun 1, 2010
Grant Date -
Mar 30, 2006
app pub date -
Nov 16, 2005
filing date -
May 20, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Two integrated circuits 1, 3, 101, 103 having circuitry on one of their major surfaces 11, 31, 111, 131 are ground on their opposite major surfaces 13, 33 to reduce their thickness. The ground integrated circuits are then adhered together to form a composite body 7 and placed in a chamber 97, 197 formed within a substrate 9, 109 such as a printed circuit board. Electrical connections are formed between contacts 15, 35, 115, 135 of the integrated circuits 1, 3, 101, 103 and contacts 92, 192 of the substrate 9, 109. Components 22 may be mounted on the outer surfaces 24 of the substrate 9, 109.
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