Microelectronic contact structure
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United States of America Patent
Stats
-
Jun 8, 2010
Grant Date -
Nov 22, 2007
app pub date -
Sep 16, 2005
filing date -
Dec 23, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A probing apparatus can include a plurality of contact probes, which can be of a type that is disposed along an axis. Each contact probe can include a contact portion, a base portion, and resilient portion. Multiple arms can form the resilient portion, which can be disposed between the contact portion and the base portion. The contact probes can be configured to twist when compressed. The probing apparatus can also include a substrate with through holes, and the contact probes can be inserted into the through holes. The resilient portion of each of the contact probes can bias the contact portion such that at least a portion of the contact portion extends out of a through hole.
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