Process of forming a microperforated polymeric film for sound absorption

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United States of America Patent

PATENT NO 7731878
SERIAL NO

11015930

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Abstract

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mils, a narrowest diameter less than a film thickness, and a widest diameter greater than narrowest diameter. The widest diameter may be about 125% or more of the narrowest diameter in an embodiment.

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Patent Owner(s)

Patent OwnerAddress
3M INNOVATIVE PROPERTIES COMPANYST PAUL MN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wood, Kenneth Brian St. Paul, US 3 117

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