Etch singulated semiconductor package
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United States of America Patent
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Jun 8, 2010
Grant Date -
N/A
app pub date -
Feb 4, 2009
filing date -
Dec 2, 2005
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Abstract
In accordance with the present invention, there is provided various methods of simultaneously fabricating a plurality of semiconductor packages (e.g., cavity type semiconductor packages) wherein the singulation process is achieved using etching techniques as opposed to more conventional cutting techniques such as sawing or punching. Such etching techniques are inherently lower in cost and free from many of the defects induced by other cutting techniques.
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