Multi-surface contact IC packaging structures and assemblies
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United States of America Patent
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Jun 8, 2010
Grant Date -
May 5, 2005
app pub date -
Oct 12, 2004
filing date -
Oct 10, 2003
priority date (Note) -
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Abstract
A cost effective, high performance, IC package assembly of the present invention comprises stair-stepped layers of redistribution circuits from at least one chip to terminals on any of multiple surfaces and levels of the IC package assembly. Critical path circuits of the assembly have no plated vias and are directly routed from interconnection terminals which are used to interconnect the package to the IC chip terminals by flip chip or wire bond methods.
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