Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board

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United States of America Patent

PATENT NO 7732935
SERIAL NO

11408123

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A wiring board includes a substrate made of an insulation material and wired by a conductive material. A plurality of electrodes is formed on a surface of the substrate. A non-Au electrode not having an Au surface layer and an Au electrode having the Au surface layer are formed as the electrodes.

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Patent Owner(s)

Patent OwnerAddress
RICOH COMPANY LTD3-6 NAKAMAGOME 1 CHOME OHTA-KU TOKYO 143-8555
RICOH MICROELECTRONICS CO LTD10-3 KITAMURA TOTTORI-SHI TOTTORI 680-1172

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Moriyama, Eiji Tottori, JP 11 123

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