Installation for processing a substrate
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United States of America Patent
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Jun 15, 2010
Grant Date -
May 25, 2006
app pub date -
Jan 13, 2004
filing date -
Jan 13, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The invention relates to an installation, in particular a vacuum processing installation for processing a substrate (130), in particular a semiconductor wafer, comprising a processing station. Said installation comprises a frame (110), to which is clamped a carrier (120), for holding and/or transporting the substrate (130), whereby the latter (130) can be fastened by its entire surface to said carrier (120). The processing station preferably comprises a chuck electrode (140) with a flat outer surface (141) and the carrier (120) can be positioned parallel and adjacent to said outer surface (141) of the chuck electrode (140). The carrier is composed in particular of a non-conductive dielectric material and is provided on one side with a conductive layer (122), in such a way that the chuck electrode (140) and the carrier (120) form an electrostatic chuck.
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