Resin composition and flexible printed circuit board
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United States of America Patent
Stats
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Jun 15, 2010
Grant Date -
Jun 25, 2009
app pub date -
Feb 23, 2009
filing date -
Nov 30, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A resin composition characterized as containing (A) a synthetic resin having a melting temperature of 300.degree. C. or above and (B) a platy inorganic filler incorporated in the resin and having the following properties; pH of aqueous dispersion: 5.5-8.0, amount of extracted alkalis: Na 30 ppm or below and K 40 ppm or below, maximum diameter a: 50 .mu.m or below, thickness b: 1.0 .mu.m or below, and aspect ratio (a/b): 20 or above.
First Claim
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International Classification(s)
- C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
- C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
- H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
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