Semiconductor package
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United States of America Patent
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Jun 15, 2010
Grant Date -
May 14, 2009
app pub date -
Nov 8, 2007
filing date -
Nov 8, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor package. The semiconductor package of the invention comprises: a substrate comprising at least one exposed area with photosensitive devices; a cover for isolating the exposed area from the external atmosphere, wherein one of either the substrate or the cover is a base, and the other is a top structure; and a dam formed on the base to form a cavity, wherein the top of the dam has a recess, the dam is attached the top structure by an adhesive, and the cavity corresponds to the exposed area.
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