Multi-surface IC packaging structures and methods for their manufacture
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 15, 2010
Grant Date -
Jul 20, 2006
app pub date -
Feb 13, 2006
filing date -
Sep 24, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully