Method and apparatus for wafer marking
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United States of America Patent
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Jun 15, 2010
Grant Date -
Jan 1, 2009
app pub date -
Jun 20, 2008
filing date -
Jun 22, 2007
priority date (Note) -
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Abstract
A semiconductor substrate is provided. The substrate includes a first surface and an opposing second surface, wherein the first surface includes a marking in a centroid region of the first surface. The marking indicates a location of a center point on the first surface of the semiconductor substrate or identification data unique to the substrate. A system, methods of transporting and marking, and a device for reading the substrate markings are also provided.
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