Test apparatus having pogo probes for chip scale package
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United States of America Patent
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Jun 15, 2010
Grant Date -
Nov 26, 2009
app pub date -
Jul 9, 2008
filing date -
May 22, 2008
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A pogo-type probe to be installed in a probe socket and a probe card for testing chip scale package of a semiconductor device is characterized in that the pogo probe has a hollow main body for receiving at least one resilient element internally and the main body comprises two end portions disposed with a first probe head and a second probe head respectively, wherein each of the probe heads is composed of a plurality of taper members to form a crown shape, and each of the taper members has an individual chamfer so that each chamfer has a tip to contact each contact pad of the semiconductor device under test for chip scale package.
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