Electrodes, inner layers, capacitors, electronic devices and methods of making thereof
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United States of America Patent
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Jun 22, 2010
Grant Date -
Dec 21, 2006
app pub date -
Jun 15, 2006
filing date -
Jun 20, 2005
priority date (Note) -
Expired
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Abstract
A method of embedding thick-film fired-on-foil capacitors includes entirely covering the dielectric with an encapsulating electrode to avoid cracking in the dielectric due to shrinkage and temperature coefficient of expansion differences between the electrode and dielectric.
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