Solderable lid or cover for an electronic circuit
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United States of America Patent
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Jun 29, 2010
Grant Date -
N/A
app pub date -
Feb 28, 2006
filing date -
Mar 1, 2005
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A solderable cover for solder attachment to an electronic substrate comprises a non-solderable cover defining an attachment pattern, a solderable metal layer in the shape of the attachment pattern, and a layer of adhesive bonding the solderable metal layer to the attachment pattern of the non-solderable cover, wherein the adhesive exhibits bond strength and resiliency sufficient to maintain the solderable metal layer attached to the non-solderable cover when raised in temperature to a melting temperature of a solder.
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