Wire bond interconnection
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United States of America Patent
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-
Jun 29, 2010
Grant Date -
Jun 12, 2008
app pub date -
Feb 15, 2008
filing date -
Nov 12, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A wire bond interconnection between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger, a ball bond on the die pad, and a stitch bond on the support pedestal, in which a width of the lead finger at the bond site is less than a diameter of the support pedestal. Also, a semiconductor package including a die mounted onto and electrically connected by a plurality of wire bonds to a substrate, in which each of the wire bonds includes a wire ball bonded to a pad on the die and stitch bonded to a support pedestal on a bond site on a lead finger, and in which the width of the lead finger at the bond site is less than the diameter of the support pedestal.
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