Integrated circuit and seed layers
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United States of America Patent
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Jun 29, 2010
Grant Date -
Jan 1, 2009
app pub date -
Jun 24, 2008
filing date -
Jan 18, 2000
priority date (Note) -
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Abstract
Structures are provided that include a conducting layer disposed on a layered arrangement of a diffusion barrier layer and a seed layer in an integrated circuit. Apparatus and systems having such structures and methods of forming these structures for apparatus and systems are disclosed.
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